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1 of 17 rev: 082203 note: some revisions of this device may incorporate deviations from published specifications known as errata. multiple revisions of any device may be simultaneously available through various sales channels. for information about device errata, click here: www.maxim-ic.com/errata . features real-time clock (rtc) keeps track of hundredths of seconds, seconds, minutes, hours, days, date, months, and years with automatic leap-year compensation valid up to the year 2100 2m x 8 nv sram watch function is transp arent to ram operation automatic data protec tion during power loss unlimited write-cycle endurance surface-mountable bga module construction over 10 years of data retention in the absence of power battery monitor checks remaining capacity daily +3.3v or +5v operation applications telecom switches routers raid systems typical operating circuit package outline ordering information part pin- package temp range top mark DS1254wb- 150 bga, 3.3v 0c to +70c DS1254w- 150 DS1254yb- 100 bga, 5v 0c to +70c DS1254y- 100 DS1254wb2- 150 bga, 3.3v 0c to +70c DS1254w2- 150 DS1254yb2- 100 bga, 5v 0c to +70c DS1254y2- 100 pin description v cc - supply voltage a0?a20 - address inputs dq0?dq7 - data i/o ce - chip-enable input oe - output-enable input we - write-enable input bw - battery warning output (open drain) gnd - ground DS1254 2m x 8 nv sram with phantom clock www.maxim-ic.com side -a- shown (for reference only, not to scale) component placement may vary. .com .com .com 4 .com u datasheet
DS1254 2 of 17 description the DS1254 is a fully nonvolatile static ram (nv sram ) (organized as 2m words by 8 bits) with built- in real-time clock. it has a self-contained lithium energy source and control circuitry that constantly monitors v cc for an out-of-tolerance cond ition. when such a condition occurs, the DS1254 makes use of an attached ds3800 battery cap to maintain clock info rmation and preserve stor ed data while protecting that data by disallowing all memory accesses. a dditionally, the DS1254 has dedicated circuitry for monitoring the status of an attached ds3800 battery cap. the phantom clock provides timekeeping information including hundredths of seconds, seconds, minutes, hours, day, date, month, and year information. the date at the end of the month is automatically adjusted for months with fewer than 31 days, including correc tion for leap years. the phantom clock operates in either 24-hour or 12-hour format with an am/pm indicator. because the DS1254 has a total of 168 balls and only 35 active signals, balls are wired together into groups, thus providing redundant connections for every signal. figure 1. pin assignment v cc a7 a6 a5 gnd a4 a3 a2 a1 1 2 3 4 5 6 7 8 9 29 28 27 26 25 24 23 22 21 10 11 12 13 14 15 16 17 18 19 20 41 40 39 38 37 36 35 34 33 32 31 30 v cc a 17 a 18 a 19 gnd a 20 ce oe we a0 dq0 dq1 dq2 dq3 gnd dq4 dq5 dq6 dq7 b w v cc a 8 a 9 a 10 a 11 gnd a 12 a 13 a 14 a 15 a 16 v cc receptacles for ds3800 battery cap pins gnd v bat dallas semiconductor DS1254 .com .com .com .com 4 .com u datasheet
DS1254 3 of 17 ram read mode the DS1254 executes a read cycle whenever we is inactive (high) and ce is active (low). the unique address specified by the 21 address inputs (a0?a20) defi nes which of the 2mb of data is to be accessed. valid data will be available to the eight data-output drivers within t acc (access time) after the last address input is stable, providing that ce and oe access times and states are also satisfied. if oe and ce access times are not satisfied, then data access must be measured from the later occurring signal ( ce or oe ) and the limiting parameter is either t co for ce or t oe for oe rather than address access. ram write mode the DS1254 is in the write mode whenever we and ce are in their active (low) state after address inputs are stable. the later occurring falling edge of ce or we will determine the start of the write cycle. the write cycle is terminated by the earlier rising edge of ce or we . all address inputs mu st be kept valid throughout the write cycle. we must return to the high state for a minimum recovery time (t wr ) before another cycle can be initiated. the oe control signal should be kept inactive (high) during write cycles to avoid bus contention. however, if the output bus has been enabled ( ce and oe active), then we will disable the outputs in t odw from its falling edge. data retention mode the device is fully accessible and data can be written and read only when v cc is greater than v pf . however, when v cc falls below the power-fail point, v pf (point at which write protection occurs), the internal clock registers and sram are blocked from any access. when v cc falls below v bat , device power is switched from the v cc to v bat . rtc operation and sram data are maintained from the battery until v cc is returned to nominal levels. all signals must be powered down when v cc is powered down. phantom clock operation communication with the phantom clock is established by pattern recognition on a serial bit stream of 64 bits that must be matched by executing 64 consecu tive write cycles containing the proper data on dq0. all accesses that occur prior to recognition of the 64-bit pattern are directed to memory. after recognition is established, the next 64 read or write cycles either extract or update data in the phantom clock, and memory access is inhibited. data transfer to and from the timek eeping function is accomplished with a serial bit stream under control of chip enable ( ce ), output enable ( oe ), and write enable ( we ). initially, a read cycle to any memory location using the ce and oe control of the phantom clock starts the pattern-recognition sequence by moving a pointer to the first bit of the 64-bit comp arison register. next, 64 consecutive write cycles are executed using the ce and we signals of the device. these 64 write cycles are used only to gain access to the phantom clock. therefore, any address within the first 512kb of memory, (00h to 7ffffh) is acceptable. however, the write cycles generated to gain access to the phantom clock are also writing data to a location in the memory. the preferred way to manage this requirement is to set aside just one address location in memory as a phantom clock scratch pad. when the first write cycle is executed, it is compared to bit 0 of the 64-bit comparison register. if a match is found, the pointer increments to the next location of the comparison register and awaits the next write cycle. if a match is not found, the pointer does not .com .com .com .com 4 .com u datasheet
DS1254 4 of 17 advance and all subsequent write cycles are ignored. if a read cycle occurs at any time during pattern recognition, the present sequence is aborted and the comparison register pointer is reset. pattern recognition continues for a total of 64 write cycles as described above until all the bits in the comparison register have been matched (this b it pattern is shown in figure 2). with a correct match for 64-bits, the phantom clock is enabled and data transfer to or from the timekeeping registers can proceed. the next 64 cycles will cause the phantom clock to either receive or transmit data on dq0, depending on the level of the oe pin or the we pin. cycles to other locations outside th e memory block can be interleaved with ce cycles without interrupting the pattern-recognition se quence or data-transfer sequence to the phantom clock. phantom clock register information the phantom clock information is contained in eight registers of 8 bits, each of which is sequentially accessed one bit at a time after the 64-bit pattern-recognition sequence has been completed. when updating the phantom clock registers, each register mu st be handled in groups of 8 bits. writing and reading individual bits within a register could produce erroneous results. these read/write registers are defined in figure 3. figure 2. phantom clock protocol definition note: the pattern recognition in hex is c5, 3a, a3, 5c, c5, 3a, a3, 5c. the odds of this pattern being a ccidentally duplicated and causin g inadvertent entry to the phantom clock is less than 1 in 10 19 . this pattern is sent to the phantom clock lsb to msb. .com .com .com .com 4 .com u datasheet
DS1254 5 of 17 figure 3. phantom clock register definition .com .com .com .com 4 .com u datasheet
DS1254 6 of 17 am/pm/12/24 mode bit 7 of the hours register is defi ned as the 12-hour or 24-hour mode se lect bit. when high, the 12-hour mode is selected. in the 12-hour mode, bit 5 is the am/pm bit with logic high being pm. in the 24-hour mode, bit 5 is the second 10-hour bit (20?23 hours). oscillator bit bit 5 of the day register controls the oscillator. when set to logic 1, the oscillator is off. when set to logic 0, the oscillator turns on and the watch becomes operational. zero bits registers 1, 2, 3, 4, 5, and 6 contain one or more bits that will always read logic 0. when writing these locations, either a logic 1 or logic 0 is acceptable. battery monitoring the DS1254 automatically monitors the battery in an attached ds3800 battery cap on a 24-hour time interval. such monitoring begins within t rec after v cc rises above v pf and is suspended when power failure occurs. after each 24-hour period has elapsed, the ba ttery is connected to an internal 1m test resistor for one second. during this one second, if th e battery voltage falls below the ba ttery-voltage trip point (~2.6v), the battery warning output bw is asserted. once asserted, bw remains active until the attached ds3800 battery cap is replaced. however, the battery is still retested after each v cc power-up, even if it was active on power-down. if the battery voltage is found to be higher than ~2.6v during such testing, bw is de-asserted and regular testing resumes. bw has an open-drain output driver. .com .com .com .com 4 .com u datasheet
DS1254 7 of 17 absolute maximum ratings voltage range on any pin relative to ground -0.3v to +6.0v operating temperature range 0 c to +70 c storage temperature range -40 c to +70 c soldering temperature see ipc/jedec j-std-020a stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of t he specifications is not implied. exposure to the absolute maximum rating conditions for extended periods may affect device. recommended dc operating conditions (t a = 0 c to +70 c) parameter symbol conditions min typ max units notes power-supply voltage (5v operation) v cc 4.5 5.0 5.5 v 1 power-supply voltage (3.3v operation) v cc 3.0 3.3 3.7 v 1 v cc = 5v 10% 2.2 v cc + 0.3 logic 1 voltage (all inputs) v ih v cc = 3.3v 10% 2.0 v cc + 0.3 v 1 v cc = 5v 10% -0.3 0.8 logic 0 voltage (all inputs) v il v cc = 3.3v 10% -0.3 0.6 v 1 dc electrical characteristics (v cc = 5.0v 10%, t a = 0 c to +70 c.) parameter symbol min typ max units notes input leakage current i il -4.0 +4.0 a i/o leakage current i io -4.0 +4.0 a output current at 2.4v i oh -1.0 ma 3 output current at 0.4v i ol 2.0 ma 3 standby current ( ce = 2.2v) i ccs1 5.0 10 ma standby current ( ce = v cc - 0.5v) i ccs2 3.0 5.0 ma operating current, t cyc = 100ns i cco1 85 ma write protection voltage v pf 4.25 4.50 v 1 dc electrical characteristics ( v cc = 3.3v 10% , t a = 0 c to +70 c.) parameter symbol min typ max units notes input leakage current i il -4.0 +4.0 a i/o leakage current i io -4.0 +4.0 a output current at 2.4v i oh -1.0 ma 3 output current at 0.4v i ol 2.0 ma 3 standby current ( ce = 2.2v) i ccs1 5.0 7 ma standby current ( ce = v cc - 0.5v) i ccs2 2.0 3.0 ma operating current, t cyc = 100ns i cco1 50 ma write protection voltage v pf 2.8 2.97 v 1 .com .com .com .com 4 .com u datasheet
DS1254 8 of 17 capacitance (t a = +25 c) parameter symbol min typ max units notes input capacitance: a0 to a18, oe , we , ce c in 25 50 pf input capacitance: a19 to a20 c in 5 10 pf i/o capacitance: dq0 to dq7 c io 25 50 pf output capacitance: bw c out 5 10 pf ac electrical characteristics (v cc = 5.0v 10%, t a = 0 c to +70 c.) parameter symbol min max units notes read cycle time t rc 100 ns address access time t aac 100 ns oe to output valid t oe 55 ns ce to output valid t co 100 ns ce or oe to output active t coe 0 ns 2 output high-z from deselection t od 35 ns 2 output hold from address change t oh 5 ns write cycle time t wc 100 ns we , ce pulse width t wp 70 ns 5 address setup time t aw 0 ns t ah1 5 ns 6 address hold time t ah2 25 ns 7 output high-z from we t odw 35 ns 2 output active from we t oew 5 ns 2 data setup time t ds 40 ns 8 t dh1 0 ns 6 data hold time t dh2 20 ns 8 read recovery (clock access only) t rr 20 ns write recovery (clock access only) t wr 20 ns .com .com .com .com 4 .com u datasheet
DS1254 9 of 17 ac electrical characteristics (v cc = 3.3v 10%, t a = 0 c to +70 c) parameter symbol min max units notes read cycle time t rc 150 ns address access time t aac 150 ns oe to output valid t oe 75 ns ce to output valid t co 150 ns ce or oe to output active t coe 0 ns 2 output high-z from deselection t od 70 ns 2 output hold from address change t oh 5 ns write cycle time t wc 150 ns we , ce pulse width t wp 100 ns 5 address setup time t aw 0 ns t ah1 5 ns 6 address hold time t ah2 25 ns 7 output high-z from we t odw 70 ns 2 output active from we t oew 5 ns 2 data setup time t ds 60 ns 8 t dh1 0 ns 6 data hold time t dh2 20 ns 8 read recovery (clock access only) t rr 20 ns write recovery (clock access only) t wr 20 ns .com .com .com .com 4 .com u datasheet
DS1254 10 of 17 figure 4. memory read cycle timing (note 9) figure 5. memory write cycle timing, write-enable controlled (notes 5, 6, 8, 10, 11, 12, and 13) t rc address t acc ce oe dq0?dq7 t oh t co t oe t coe t coe t od t od output data valid t wc t ah1 t aw t oew t ds data in stable t dh1 t odw t wp address ce we dq0?dq7 .com .com .com .com 4 .com u datasheet
DS1254 11 of 17 figure 6. memory write cycle timing, chip-enable controlled (notes 5, 7, 8, 10, 11, 12, and 13) figure 7. read cycle to phantom clock t wc t ah2 t aw t ds t dh2 t coe t odw t wp address ce we dq0?dq7 data in stable t rc ce oe dq0 t co t oe t coe t coe t od t od output data valid t rr we = v ih .com .com .com .com 4 .com u datasheet
DS1254 12 of 17 figure 8. write cycle to phantom clock figure 9. power-up/power-down waveform timing (note 14) v cc v pf(max) v pf(min) t f t fb t pd t dr v bat t rec t bpu slews with v cc bw t r slews with v cc ce we , power-up/power-down characteristics (v cc = 5v 10%) parameter symbol min typ max units notes ce and we at v ih before power-down t pd 0 s v cc fall time: v pf(max) to v pf(min) t f 300 s v cc fall time: v pf(min) to v bat t fb 10 s v cc rise time: 0v to v pf(min) t r 150 s v cc valid to end of write protection t rec 125 ms v cc valid to bw valid t bpu 1 s 3 (t a = +25 c) parameter symbol min typ max units notes expected data-retention time (oscillator on) t dr 10 years 4 warning: under no circumstances are negative undershoots, of any amplitude, allowed when device is in battery-backup mode. t wc t wr t ds t dh1 t wp we ce dq0 data in stable t wp oe = v ih t dh2 t ah2 .com .com .com .com 4 .com u datasheet
DS1254 13 of 17 figure 10. battery warning detection (note 3) battery warning timing (v cc = 5.0v 10%, t a = 0 c to +70 c) parameter symbol min typ max units notes battery test cycle t btc 24 hour battery test pulse width t btpw 1 seconds battery test to bw active t bw 1 seconds v cc valid to bw valid t bpu 1 seconds 3 ac test conditions output load: 100pf + 1 ttl gate input pulse levels: 0v to 3.0v timing measurement reference levels: input: 1.5v output: 1.5v input pulse rise and fall times: 5ns battery test a ctive bw v cc v bat t bpu 2.6v t btc t btpw t bw .com .com .com .com 4 .com u datasheet
DS1254 14 of 17 notes: 1) voltage referenced to ground. 2) these parameters are sampled with a 50pf load and are not 100% tested. 3) bw is an open-drain output and, as such, cannot source current. an external pullup resistor should be connected to this pin for proper operation. bw can sink 10ma. 4) the ds3800 battery cap is a one-time use part, but can be removed and replaced. by design, ds3800 removal will mechanically dama ge the battery cap, which eliminates the accidental use of a previously attached and possibly low-capacity battery cap. 5) t wp specified as the logical and of ce and we , t wp is measured from the latter of ce or we going low to the earlier of ce or we going high. 6) t ah1 , t dh1 are measured from we going high. 7) t ah2 , t dh2 are measured from ce going high. 8) t ds is measured from the earlier of ce or we going high. 9) we is high for a read cycle. 10) oe = v ih or v il . if oe = v ih during write cycle, the output buffers remain in a high-impedance state. 11) if the ce low transition occurs simultaneously with or later than the we low transition in a write- enable-controlled write cycle, the output buffers rema in in a high-impedance state during this period. 12) if the ce high transition occurs prior to or simultaneously with the we high transition, the output buffers remain in a high-impedance state during this period. 13) if we is low or the we low transition occurs prior to or simultaneously with the ce low transition, the output buffers remain in a high -impedance state during this period. 14) in a power-down condition, the voltage on any pin cannot exceed the voltage on v cc . .com .com .com .com 4 .com u datasheet
DS1254 15 of 17 package information (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline information, go to www.maxim-ic.com/dallaspackinfo .) pkg min max a in mm 1.570 39.88 1.580 40.13 b in mm 1.570 39.88 1.580 40.13 c in mm 0.033 0.84 0.043 1.09 d in mm 1.497 38.02 1.503 38.18 e in mm 0.047 1.19 0.053 1.35 f in mm 0.033 0.84 0.043 1.09 g in mm 0.047 1.19 0.053 1.35 h in mm 0.234 5.94 0.240 6.10 i in mm 0.160 4.00 0.200 5.10 k in mm 0.025 0.64 0.032 0.82 .com .com .com .com 4 .com u datasheet
DS1254 16 of 17 package information (continued) (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline information, go to www.maxim-ic.com/dallaspackinfo .) DS1254 with attached ds3800 battery cap pkg min max a in mm 1.656 42.06 1.668 42.37 b in mm 1.656 42.06 1.668 42.37 c in mm ? ? 0.485 12.32 .com .com .com .com 4 .com u datasheet
DS1254 maxim/dallas semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a ma xim/dallas semiconductor product. no circuit patent licenses are implied. maxim/dallas semiconductor reserves the right to change the circuitry and specification s without notice at any time. maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 ? 2003 maxim integrated products printed usa 17 of 17 package information (continued) (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline information, go to www.maxim-ic.com/dallaspackinfo .) recommended land pattern (with overlaid package outline) the DS1254 bga is a subset of the industry-standard 40mm bga format, with all balls on a 50-mil grid. corner balls have been removed to provide space for the electrical and mechanical interface features that facilitate attach ment of the ds3800 battery cap. 0.150 0.250 0.500 n o te note: ground shield to isolate rtc xtal from emi. .com .com .com 4 .com u datasheet

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